Autori: Fleshman Collin
| Naslov | The fractal nature analysis by applying grain formations of SAC305/OSP Cu and SAC305-0.05Ni/OSP Cu solder joints for microelectronic packaging (Article) |
| Autori | Mitic Vojislav V Fleshman Collin Duh Jenq-Gong Ilic Ivana D Lazovic Goran M 
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| Info | MODERN PHYSICS LETTERS B, (2021), vol. 35 br. 33, str. - |
| Ispravka | Web of Science Članak Elečas Rang časopisa Citati: Web of Science Scopus |
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